Customization: | Available |
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Application: | Electronics, Industrial Ceramic, Electronic Ceramic |
Grain Size: | 1-10um |
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Alumina ceramics feature:
The alumina substrates also possess several unique features:
Applications:
Network resistor, Chip resistor, Chip resistor array, Thick-film hybrid IC, Thin-film hybrid IC, General isolator
Alumina Ceramic Substrate Material Property | ||||
Item | Unit | 96% Al2O3 | 99.6% Al2O3 | |
Mechanical Properties | ||||
Color | / | / | White | Ivory |
Density | Drainage Method | g/cm3 | ≥3.70 | ≥3.95 |
Light Reflectivity | 400nm/1mm | % | 94 | 83 |
Flexural Strength | Three Point Bending | MPa | >350 | >500 |
Fracture Toughness | Indentation Method | MPa·m1/2 | 3 | 3 |
Vickers Hardness | Load 4.9N | GPa | 14 | 16 |
Young's Modulus | Stretching Method | GPa | 340 | 300 |
Water Absorption | % | 0 | 0 | |
Camber | / | Length ‰ | T≤0.3: ≤5‰, Others: ≤3‰ | ≤3‰ |
Thermal Properties | ||||
Max. Service Temperature (non-loading) | / | ºC | 1200 | 1400 |
CTE (coefficient of thermal expansion) | 200-800ºC | 1×10-6/ºC | 7.8 | 7.9 |
Thermal Conductivity | 25ºC | W/m·K | >24 | >29 |
Thermal Shock Resistance | 800ºC | ≥10 Times | No Crack | No Crack |
Specific Heat | 25ºC | J/kg·k | 750 | 780 |
Electrical Properties | ||||
Dielectric Constant | 25ºC, 1MHz | / | 9.4 | 9.8 |
Dielectric Loss Angle | 25ºC, 1MHz | ×10^-4 | ≤3 | ≤2 |
Volume Resistivity | 25ºC | Ω·cm | ≥10^14 | ≥10^14 |
Dielectric Strength | DC | KV/mm | ≥15 | ≥15 |
Alumina Ceramic Substrate Production Specifications | |||||||
99.6% Al2O3 | |||||||
Thickness (mm) | Maximum Size (mm) | Shape | Molding Technique | ||||
As Fired | Lapped | Polished | Rectangular | Square | Round | ||
0.1-0.2 | 50.8 | 50.8 | √ | √ | Tape Casting | ||
0.25 | 114.3 | 114.3 | √ | Tape Casting | |||
0.38 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
0.5 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
0.635 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
Other special thicknesses within the thickness range of 0.1-0.635mm can be achieved by lapping. | |||||||
96% Al2O3 | |||||||
Thickness (mm) | Maximum Size (mm) | Shape | Molding Technique | ||||
As Fired | Lapped | Polished | Rectangular | Square | Round | ||
0.25 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
0.3 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
0.38 | 140×190 | √ | Tape Casting | ||||
0.5 | 140×190 | √ | Tape Casting | ||||
0.635 | 140×190 | √ | Tape Casting | ||||
0.76 | 130×140 | √ | Tape Casting | ||||
0.8 | 130×140 | √ | Tape Casting | ||||
0.89 | 130×140 | √ | Tape Casting | ||||
1 | 280×240 | √ | Tape Casting | ||||
1.5 | 165×210 | √ | Tape Casting | ||||
2 | 500×500 | √ | Tape Casting | ||||
Other special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping. |
Alumina Ceramic Substrate Product Tolerance | ||||
Item | Substrate Thickness (mm) | Standard Tolerance (mm) | Best Tolerance (mm) | Laser Cutting Tolerance (mm) |
Length And Width Tolerance | / | ±2 | ±0.15 | |
Thickness Tolerance | T<0.3 | ±0.03 | ±0.01 | |
0.30-1.0 | ±0.05 | ±0.01 | ||
T>1.0 | ±10% | ±0.01 |
Alumina Ceramic Substrate Surface roughness | |||
Material | Surface Roughness (μm) | ||
As Fired | Lapped | Polished | |
96% Al2O3 | Ra 0.2-0.75 | Ra 0.3-0.7 | Ra ≤0.05 |
99.6% Al2O3 | Ra 0.05-0.15 | Ra 0.1-0.5 | Ra ≤0.05 |
Inspection Of Bare Ceramic Substrates | ||
Test ltems | Inspection Tool | Inspection Standard |
Appearance | VisualInspection,Microscope | In accordance with the drawing |
Length And Width | Vernier Caliper | |
Thickness | Thickness Gauge,Micrometer | |
Camber | Digimatic lndicater | |
Surface Roughness | Surface Roughness Meter |
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