Tfc Thin Film Sin Substrate in RF Modules

Product Details
Customization: Available
Application: Industrial Ceramics
Grain Size: 1-10um
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  • Tfc Thin Film Sin Substrate in RF Modules
  • Tfc Thin Film Sin Substrate in RF Modules
  • Tfc Thin Film Sin Substrate in RF Modules
  • Tfc Thin Film Sin Substrate in RF Modules
  • Tfc Thin Film Sin Substrate in RF Modules
  • Tfc Thin Film Sin Substrate in RF Modules
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  • Overview
  • Product Parameters
  • Manufacturing Process
  • Research & Development
  • Related Products
  • Company Profile
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  • FAQ
Overview

Basic Info.

Model NO.
ANSUBSTRATE
Purity
95%
Type
Ceramic Plate
Delivery
30 Days
Thermal Conductivity
Min 24 W/Mk
Young′s Modulus
340 Gpa
Thickness
0.2-2mm
Forming Method
Tape Casting
Transport Package
by Carton
Specification
A Pack Of 100 Piece, A Box 17-26kg
Trademark
Aonuo
Origin
China
HS Code
6909900000
Production Capacity
100.000.000 PCS/Year

Product Description

Product Description

Tfc Thin Film Sin Substrate in RF Modules

Alumina ceramic substrate is a type of ceramic material commonly used in electronics, particularly in the manufacturing of integrated circuits (ICs), semiconductors, and other electronic components. Alumina ceramic, also known as aluminum oxide (Al2O3), offers several desirable properties that make it suitable for these applications

·High thermal conductivity
·Electrical insulation
·Chemical inertness
·Mechanical strength
·Dimensional stability

These properties make alumina ceramic substrates widely used in the fabrication of electronic circuit boards, especially in high-power and high-frequency applications where thermal management is critical. Additionally, alumina substrates are often used as a base material for mounting and packaging electronic components due to their excellent thermal and electrical properties.

Product Parameters
Alumina Ceramic Substrate Material Property
Item Unit 96% Al2O3 99.6% Al2O3
Mechanical Properties
Color / / White Ivory
Density Drainage Method g/cm3 3.70 3.95
Light Reflectivity 400nm/1mm % 94 83
Flexural Strength Three Point Bending MPa >350 >500
Fracture Toughness Indentation Method MPa·m1/2 3 3
Vickers Hardness Load 4.9N GPa 14 16
Young's Modulus Stretching Method GPa 340 300
Water Absorption    % 0 0
Camber / Length ‰ T≤0.3: ≤5‰, Others: ≤3‰ ≤3‰
Thermal Properties
Max. Service Temperature (non-loading) / ºC 1200 1400
CTE (coefficient of thermal expansion) 200-800ºC 1×10-6/ºC 7.8 7.9
Thermal Conductivity 25ºC W/m·K >24 >29
Thermal Shock Resistance 800ºC 10 Times No Crack No Crack
Specific Heat 25ºC J/kg·k 750 780
Electrical Properties
Dielectric Constant 25ºC, 1MHz / 9.4 9.8
Dielectric Loss Angle 25ºC, 1MHz ×10^-4 ≤3 ≤2
Volume Resistivity 25ºC Ω·cm 10^14 10^14
Dielectric Strength DC KV/mm 15 15
   
Alumina Ceramic Substrate Surface roughness
Material Surface Roughness (μm)
As Fired Lapped Polished
96% Al2O3 Ra 0.2-0.75 Ra 0.3-0.7 Ra ≤0.05
99.6% Al2O3 Ra 0.05-0.15 Ra 0.1-0.5 Ra ≤0.05
 
Manufacturing Process

Tfc Thin Film Sin Substrate in RF Modules
Research & Development

Tfc Thin Film Sin Substrate in RF Modules
Related Products

Tfc Thin Film Sin Substrate in RF Modules
Company Profile

Tfc Thin Film Sin Substrate in RF Modules

Tfc Thin Film Sin Substrate in RF Modules

Certifications

Tfc Thin Film Sin Substrate in RF Modules

Packaging & Shipping

Tfc Thin Film Sin Substrate in RF Modules
FAQ

FAQ

Q1: What are the main applications of Alumina ceramic substrates?
Alumina ceramic substrates from Binzhou Aonuo New Material Technology Co., Ltd. are extensively used in the electronics industry, particularly in the production of circuit boards and electronic packages. These advanced substrates are also integral to the automotive, aerospace, and medical device sectors.

Q2: What are the advantages of using Alumina ceramic substrates?
Alumina ceramic substrates boast numerous benefits, including superior thermal conductivity, exceptional dielectric strength, and robust resistance to chemical corrosion. They also maintain dimensional stability across various operating conditions, making them a reliable choice for critical applications.

Q3: How is Alumina ceramic substrate manufactured?
The manufacturing process of Alumina ceramic substrates typically involves blending aluminum oxide powder with binders and additives to create a slurry. This slurry is then formed into the desired substrate shape using techniques such as tape casting, dry pressing, or extrusion. The shaped substrate is subsequently sintered at high temperatures to achieve its final, optimized properties.

Q4: What are the different types of Alumina ceramic substrates available?
Alumina ceramic substrates come in various types, defined by factors such as purity, grain size, surface finish, and dimensional tolerances. Common variants include high-purity Alumina (HPA) substrates, thick-film Alumina substrates, and metallized Alumina substrates designed for electronic applications.

Q5: What considerations should be made when selecting Alumina ceramic substrates?
When selecting Alumina ceramic substrates, it's crucial to consider elements like thermal conductivity, dielectric strength, surface roughness, dimensional precision, and compatibility with manufacturing processes to ensure optimal performance in specific applications.

Q6: Can Alumina ceramic substrates be customized for specific requirements?
Absolutely, Binzhou Aonuo New Material Technology Co., Ltd. offers customization services to meet specific customer requirements. These can include tailored dimensions, shapes, surface finishes, and metallization patterns to suit diverse applications.

Q7: What are some typical quality control measures for Alumina ceramic substrates?
Quality control for Alumina ceramic substrates involves stringent material testing for purity and consistency, dimensional inspections, surface roughness assessments, and comprehensive electrical testing to ensure compliance with specified performance standards.

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