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High Heat Spreading Amb Active Metal Brazing Al2O3 Substrate Used in Electronics Packaging and Power Modules pictures & photos
High Heat Spreading Amb Active Metal Brazing Al2O3 Substrate Used in Electronics Packaging and Power Modules pictures & photos
High Heat Spreading Amb Active Metal Brazing Al2O3 Substrate Used in Electronics Packaging and Power Modules pictures & photos
High Heat Spreading Amb Active Metal Brazing Al2O3 Substrate Used in Electronics Packaging and Power Modules pictures & photos
High Heat Spreading Amb Active Metal Brazing Al2O3 Substrate Used in Electronics Packaging and Power Modules pictures & photos
High Heat Spreading Amb Active Metal Brazing Al2O3 Substrate Used in Electronics Packaging and Power Modules pictures & photos
  • High Heat Spreading Amb Active Metal Brazing Al2O3 Substrate Used in Electronics Packaging and Power Modules
  • High Heat Spreading Amb Active Metal Brazing Al2O3 Substrate Used in Electronics Packaging and Power Modules
  • High Heat Spreading Amb Active Metal Brazing Al2O3 Substrate Used in Electronics Packaging and Power Modules
  • High Heat Spreading Amb Active Metal Brazing Al2O3 Substrate Used in Electronics Packaging and Power Modules
  • High Heat Spreading Amb Active Metal Brazing Al2O3 Substrate Used in Electronics Packaging and Power Modules
  • High Heat Spreading Amb Active Metal Brazing Al2O3 Substrate Used in Electronics Packaging and Power Modules
Application: Industrial Ceramics
Material: Al2O3
Thickness: 0.2-2mm
Delivery: 30 Days
Thermal Conductivity: Min 24 W/Mk
Young′s Modulus: 340 Gpa
Samples:
US$ 0.04/Piece 1 Piece(Min.Order)
| Request Sample
Customization:

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