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High Heat Spreading Dbc Direct Bond Copper Alumina Substrate Used in Electronics Packaging and Power Modules

Name: High Heat Spreading Dbc Direct Bond Copper Alumina Substrate Used in Electronics Packaging and Power Modules
Brand: Binzhou Aonuo New Material Technology Co., Ltd.
SKU: snwrTyeJggYD
Price: 0.04 USD
Availability: InStock

High Heat Spreading Dbc Direct Bond Copper Alumina Substrate Used in Electronics Packaging and Power Modules pictures & photos

Application:	Industrial Ceramics
Thickness:	0.2-2mm
Delivery:	30 Days
Thermal Conductivity:	Min 24 W/Mk
Young′s Modulus:	340 Gpa
Forming Method:	Tape Casting

Samples:	US$ 0.04/Piece 1 Piece(Min.Order) \| Request Sample

Customization:	Available \| Customized Request

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